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Miniaturization and high heat flux of power electronic devices have posed a colossal challenge for adequate thermal management. Conventional air-cooling solutions are inadequate for high-performance electronics. Liquid cooling is an alternative solution thanks to the higher specific heat and latent heat associated with the coolants. Liquid-cooled cold plates are typically manufactured by different approaches such as: skived, forged, extrusion, electrical discharge machining. When researchers are facing challenges at creating complex geometries in small spaces, 3D-printing can be a solution. In this paper, a 3D-printed cold plate was designed and characterized with water coolant. The printed metal fin structures were strong enough to undergo pressure from the fluid flow even at high flow rates and small fin structures. A copper block with top surface area of 1 inch by 1 inch was used to mimic a computer chip. Experimental data has good match with a simulation model which was built using commercial software 6SigmaET. Effects of geometry parameters and operating parameters were investigated. Fin diameter was varied from 0.3 mm to 0.5 mm and fin height was maintained at 2 mm. A special manifold was designed to maximize the surface contact area between coolant and metal surface and therefore minimize thermal resistance. The flow rate was varied from 0.75 L/min to 2 L/min and coolant inlet temperature was varied from 25 to 48 oC. It was observed that for the coolant inlet temperature 25 oC and aluminum cold plate, the junction temperature was kept below 63.2 oC at input power 350 W and pressure drop did not exceed 23 Kpa. Effects of metal materials used in 3D-printing on the thermal performance of the cold plate were also studied in detail.